Images above: A porous silicon sample with straight uniform pores as deep as 15 micrometers and opening diameters of 1.5 micrometers.
Research Areas (Click on research area to go to page):
- Advanced Manufacturing: Smart Manufacturing; Industrial Internet of Things (IIoT); Intelligent Industrial Robotics ( NSF Grant numbers 1801120 and 2000685), and Mechatronics
- Micro-Electro-Mechanical Systems (MEMS):
- Characterization of Transmembrane Proteins: Keywords: Epithelial Sodium Channel (ENaC) protein; Lipid Bilayer Membranes; Atomic Force Microscopy
- Microfluidics: Photodefinable Glass is used to fabricate microstructues
- Ultra sensitive Sensors and Microstructures made in Porous Silicon
NSF Award 1801120 of $525,000 (Principal Investigator)
NSF Award 2000685 of $198,065 (Principal Investigator)
NSF Award 2130658 of $450,000 (Co-Principal Investigator)
Research in the News:
2. Basic MEMS Fabrication: Video Taken and produced by undergraduate students Benjamin Burns, Josh Killingsworth, Roslyn Brown, and Jonathan Bradford, starring Khalid Tantawi. Video produced in 2010.
3. Porous Silicon Processing: Producing porous silicon with hole diameters 1000 times less than the width of a human hair. Produced in Nano & Micro Devices Center. University of Alabama in Huntsville. Porous Si is biocompatible, and is used in optoelectronics due to its florescence, it is also very active chemically. Khalid Tantawi in the news article of Oakwood University: http://www.oakwood.edu/zPublic/public-relations/oakwood-magazine/OU-Magazine-Winter-14.pdf
Major Research Equipment available at Dr. Tantawi’s Lab:
- Atomic Force Microscope: Quesant
- Potentiostat/Galvanostat: Versastat 3-460 by Princeton Applied Research with capability to perform electrochemical impedance spectroscopy, electroplating, and electrochemical etching with a maximum current of +/- 2 A, and a current resolution of 200 nA and a voltage resolution of 300 nV and a frequency range of 10 µHz to 1 MHz.
- Raman Spectrometer system: PeakSeekerTM system with a signal-to-noise ratio of 250:1 and detection capability of wavenumbers 3000 to 200 cm-1 at a resolution of 9 cm-1 powered by a 785 nm laser
- Optical Microscope with digital image capturing capability: RS Microscope system with a 10x eye lens and up to 40x objective, equipped with a 1.3 MP camera.
- Three-dimensional printing machines: Monoprice IIIP printers that use Fused Filament technology capable of resolutions down to 100 um and a positioning accuracy of 4 to 12 um, as well as other 3D printers.
Equipment available at the Mechatronics Department:
- Milling and Machining: The department has its own Denford MicroMill Three-axes milling machine with a resolution of 10 micrometers.
- Intelligent high-Precision robot: ABB Yumi collaborative robot for pharmaceutical and electronic applications with a payload capability of 500 grams and positioning repeatability of 20 micrometers.
- Drone with thermal imaging capability: DJI Inspire 1 drone equipped with a ZENMUSE XT thermal camera with a thermal sensitivity of less than 50 mK at f/1.0, and a ZENMUSE X3 4K 12 MP camera.
|Denso VS087A4||ABB Yumi|
|Weight:||51 kg||38 kg|
|Payload:||7 kg||0.5 kg|
|Repeatability:||30 micrometers||20 micrometers|
|Maximum reach:||905 mm||559 mm|
|Number of axes:||6||14 (7 per arm)|
|Maximum wrist torque:||16.2 N.m around J5 6.86 N.m around J6||0.64 N.m around J5 0.23 N.m around J6|
|Maximum moment of inertia||0.450 kg.m2 around J5 0.100 kg.m2 around J6||0.012 kg.m2 around J5 0.009 kg.m2 around J6|
|Maximum TCP speed:||11,000 mm/s||1,500 mm/s|
|Cycle Time:||0.34 Sec (1 kg for 300 mm at 25 mm height)||0.86 sec (0.5 kg for 300 mm at 25 mm height)|